|
|
A. Vandooren, B. Parvais, A. Walke, A. Vais, C. Merckling, D. Lin, N. Waldron, P. Wambacq, D. Mocuta and N. Collaert, “3D technologies for analog/RF applications,” in 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017, Institute of Electrical and Electronics Engineers Inc, Mar. 2018, pp. 3.
|
|
