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@InProceedings{Pub_10298, author = {B. Parvais, L. Peng, L. Teugels, E. Rosseel, A. Vandooren, A. Khaled, J. Franco, A. Walke, N. Rassoul, P. Matagne, H. Debruyn, G. Jamieson, F. Inoue, E. Vecchio, T. Zheng, D. Radisic, W. Vanherle, A. Hikavyy, B. T. Chan, G. Besnard, W. Schwarzenbach, G. Gaudin, I. Radu, N. Waldron, V. De Heyn, J. Boemmels, N. Collaert and D. Mocuta}, title={Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications}, booktitle = {39th Symposium on VLSI Technology, VLSI Technology 2019}, publisher = {Institute of Electrical and Electronics Engineers Inc}, month={Jun}, year={2019} }
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