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@Article{Pub_9953, author = {B. Parvais, L. Peng, L. Teugels, E. Rosseel, A. Vandooren, J. Franco, A. Walke, V. Deshpande, F. M. Bufler, N. Rassoul, G. Hellings, G. Jamieson, F. Inoue, G. Verbinnen, E. Vecchio, T. Zheng, W. Vanherle, A. Hikavyy, B. T. Chan, R. Ritzenthaler, G. Besnard, W. Schwarzenbach, G. Gaudin, I. Radu, N. Waldron, V. De Heyn, D. Mocuta and N. Collaert}, title={3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability}, journal={IEEE Transactions on Electron Devices}, volume={65}, issue={11}, pages={5165-5171}, month={Nov}, year={2018} }
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