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%0 Conference Paper %A B. Parvais %A E. Rosseel %A L. Peng %A L. Teugels %A A. Vandooren %A J. Franco %A A. Mallik %A A. Hikkavyy %A N. Rassoul %A G. Jamieson %A F. Inoue %A G. Verbinnen %A E. Vecchio %A T. Zheng %A N. Waldron %A J. Boemmels %A V. De Heyn %A D. Mocuta %A N. Collaert %T Key challenges and opportunities for 3D sequential integration %B 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018 %I Institute of Electrical and Electronics Engineers Inc %8 Feb. 2019
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