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%0 Conference Paper %A W. Pan %A C. De Tandt %A F. Devisch %A R. Vounckx %A M. Kuijk %T Half-conductive Coupling for Chip-to-Chip Connections %B IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP %I IEEE -8th Topical Meeting on Electrical Performance of Electronic Packaging EDEP, Vol. 1, pp. 29-32, San Diego, USA %8 1999 %P 1
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