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%0 Conference Paper %A B. Parvais %A E. Rosseel %A L. Peng %A L. Teugels %A A. Vandooren %A J. Franco %A A. Mallik %A A. Walke %A V. Deshpande %A A. Hikavyy %A N. Rassoul %A G. Jamieson %A F. Inoue %A G. Verbinnen %A E. Vecchio %A T. Zheng %A N. Waldron %A V. De Heyn %A D. Mocuta %A N. Collaert %T Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling %B 2018 International Conference on IC Design and Technology, ICICDT 2018 %I Institute of Electrical and Electronics Engineers Inc %8 Jun. 2018 %P 4
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