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Conference Publication

@InProceedings{Pub_10298,

author = {B. Parvais, L. Peng, L. Teugels, E. Rosseel, A. Vandooren, A. Khaled, J. Franco, A. Walke, N. Rassoul, P. Matagne, H. Debruyn, G. Jamieson, F. Inoue, E. Vecchio, T. Zheng, D. Radisic, W. Vanherle, A. Hikavyy, B. T. Chan, G. Besnard, W. Schwarzenbach, G. Gaudin, I. Radu, N. Waldron, V. De Heyn, J. Boemmels, N. Collaert and D. Mocuta},

title={Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications},

booktitle = {39th Symposium on VLSI Technology, VLSI Technology 2019},

publisher = {Institute of Electrical and Electronics Engineers Inc},

month={Jun},

year={2019}

}

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Mr. Bertrand Parvais

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bparvais@etrovub.be

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