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Characterisation of Silicon Wafer Bonding Quality using Mm-wave Quasi-Optical technique Host Publication: Finds and Results from the Swedish Cyprus Expedition: A Gender Perspective at the Medelhavsmuseet Authors: A. Elhawil, J. Stiens, C. De Tandt, W. Ranson and R. Vounckx Publisher: SPIE Publication Date: Apr. 2010 Number of Pages: 6 ISBN: 978-0-8194-8184-9
Abstract: In this paper, we investigate a novel fast and reliable method to check the bonding quality of silicon wafers. It is based on illuminating the wafers with a high frequency waves (110 - 170 GHz) using quasi-optical technique. The reflected energy is used to evaluate the bonding strength. The reported experimental study is compared with the Infrared images.
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