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Half-conductive coupling interconnection technology for digital transmission between CMOS chips This publication appears in: IEEE Transactions on Advanced Packaging Authors: F. Devisch, X. Maillard, W. Pan, C. De Tandt, R. Vounckx and M. Kuijk Issue: 1 Pages: 97 Publication Date: Feb. 2002
Abstract: This paper describes how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chip standard CMOS integrated circuits. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Measurements of a complete HC-coupling, digital communication link show reliable operation up to 100 Mb/s channel speed. The two flipped prototype CMOS chips were fabricated in 0.8-mum, 5-V CMOS. The I/O pads' pitch was 150 mum
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