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Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors Host Publication: Proc. 27th ECOC 2001 Authors: C. Rooman, M. Kuijk, R. Windisch, R. Vounckx, G. Borghs, A. Plichta, M. Brinkmann, K. Gerstner, R. Strack, P. Van Daele, W. Woittiez, R. Baets and P. Heremans Publisher: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA Publication Date: Sep. 2001 Number of Pages: 1 ISBN: 0-7803-6705-7
Abstract: We present a norel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700 Mbit/s, respectively Each channel takes an area of merely, 100 mum x 100mum
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