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Half-conductive coupling interconnection technology for digital transmission between CMOS chips Host Publication: Proceedings of the International Interconnect Technology Conference Authors: W. Pan, F. Devisch, C. De Tandt, R. Vounckx and M. Kuijk Publisher: IEEE, 345 E 47TH ST, NEW YORK Publication Date: Jun. 2000 Number of Pages: 3 ISBN: 0-7803-6327-2
Abstract: This paper describes for the first time how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chipped standard CMOS chips. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any pest-processing steps. Due to shielding effects, the technology promises ultra-high-density interconnections
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