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Half-conductive Coupling for Flip Chip Interconnections Host Publication: IEEE International Workshop on Chip-Package Co-Design, CPD 2000 Authors: W. Pan, F. Devisch, C. De Tandt, R. Vounckx and M. Kuijk Publisher: IEEE International Workshop on Chip-Package Co-Design, CPD 2000, pp. 55, ETH Zürich, Zürich, Switzerland Publication Year: 2000
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