A Simple Technology for Flip Chip Interconnections Host Publication: STW/SAFE 2nd Annual Workshop on `Semiconductor Advances for Future Electronics Authors: W. Pan, C. De Tandt, F. Devisch, R. Vounckx and M. Kuijk Publisher: STW/SAFE 2nd Annual Workshop on `Semiconductor Advances for Future Electronics, STW Technology Foundation, The Netherlands Publication Year: 1999
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