Wafer-bonded thin-film surface-roughened light emitting diodes Host Publication: Finds and Results from the Swedish Cyprus Expedition: A Gender Perspective at the Medelhavsmuseet Authors: C. Rooman, S. De Jonge, C. Karnutsch, K. Streubel, M. Kuijk, B. Dutta, G. Borghs and P. Heremans Publisher: SPIE Publication Date: Jan. 2003 ISBN: 0-8194-4796-X
Abstract: We propose a new process for thin-film surface-textured LEDs that provides uniform current injection for both top and bottom contacts. The structure uses a partially conductive mirror. This eliminates the need for thick epitaxial layers and makes it possible to fabricate very large LEDs. Furthermore, the new process allows to obtain both high external quantum efficiency and high wallplug efficiency
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