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Conference Publication

%0 Conference Paper

%A B. Parvais

%A E. Rosseel

%A L. Peng

%A L. Teugels

%A A. Vandooren

%A J. Franco

%A A. Mallik

%A A. Walke

%A V. Deshpande

%A A. Hikavyy

%A N. Rassoul

%A G. Jamieson

%A F. Inoue

%A G. Verbinnen

%A E. Vecchio

%A T. Zheng

%A N. Waldron

%A V. De Heyn

%A D. Mocuta

%A N. Collaert

%T Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

%B 2018 International Conference on IC Design and Technology, ICICDT 2018

%I Institute of Electrical and Electronics Engineers Inc

%8 Jun. 2018

%P 4

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Current ETRO Authors

Mr. Bertrand Parvais

+32 (0)

bparvais@etrovub.be

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