|
|
C. Rooman, M. Kuijk, R. Windisch, R. Vounckx, G. Borghs, A. Plichta, M. Brinkmann, K. Gerstner, R. Strack, P. Van Daele, W. Woittiez, R. Baets and P. Heremans, “Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors,” in Proc. 27th ECOC 2001, IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA, Sep. 2001, pp. 1.
|
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