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@Article{Pub_7640, author = {F. Devisch, X. Maillard, W. Pan, C. De Tandt, R. Vounckx and M. Kuijk}, title={Half-conductive coupling interconnection technology for digital transmission between CMOS chips}, journal={IEEE Transactions on Advanced Packaging}, issue={1}, pages={97}, month={Feb}, year={2002} }
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