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@Article{Pub_7960, author = {J. Balachandran, S. Brebels, G. Carchon, M. Kuijk, W. De Raedt, B. Nauwelaers and E. Beyne}, title={Wafer-level package interconnect options}, journal={IEEE Transactions on very large scale integration (VLSI) Systems}, volume={14}, issue={6}, pages={654-659}, month={Jun}, year={2006} }
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