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@InProceedings{Pub_9952, author = {B. Parvais, E. Rosseel, L. Peng, L. Teugels, A. Vandooren, J. Franco, A. Mallik, A. Walke, V. Deshpande, A. Hikavyy, N. Rassoul, G. Jamieson, F. Inoue, G. Verbinnen, E. Vecchio, T. Zheng, N. Waldron, V. De Heyn, D. Mocuta and N. Collaert}, title={Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling}, booktitle = {2018 International Conference on IC Design and Technology, ICICDT 2018}, publisher = {Institute of Electrical and Electronics Engineers Inc}, month={Jun}, year={2018}, pages={4} }
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