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%0 Conference Paper %A W. Pan %A F. Devisch %A C. De Tandt %A R. Vounckx %A M. Kuijk %T Half-conductive Coupling for Flip Chip Interconnections %B IEEE International Workshop on Chip-Package Co-Design, CPD 2000 %I IEEE International Workshop on Chip-Package Co-Design, CPD 2000, pp. 55, ETH Zürich, Zürich, Switzerland %8 2000
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